Immersion cooling
Single-phase and two-phase immersion systems that submerge hardware in dielectric fluid — engineered for thermal management of rack densities exceeding 100kW.
Next-Gen Data Center Cooling
Compute that runs cooler,
denser.
Revolutionizing data center efficiency
When air can't keep up, liquid does.
As AI, machine learning, and high-performance compute push rack densities past 100kW, traditional air cooling reaches the limits of physics. Our Next-Gen Data Center Cooling practice delivers single-phase and two-phase immersion, direct-to-chip liquid loops, and full facility design — cutting cooling energy by up to half and unlocking PUE ratios as low as 1.05.
Direct-to-chip
Precision liquid loops and cold plates that deliver coolant straight to processors and GPUs through micro-channels — ideal for ultra-high density AI/HPC deployments.
Facility design
Greenfield architecture and brownfield retrofits engineered for liquid cooling — floor loading, fluid distribution, heat rejection, and space efficiency from day one.
PUE optimization
Performance analysis and tuning that drive industry-leading Power Usage Effectiveness ratios — with measurable ESG impact and significant operating-cost reduction.
By the numbers
Liquid & immersion, in numbers.
Hard targets we engineer toward on every deployment — not aspirations.
1.05
PUE target
vs. 1.4–2.0+ on traditional air-cooled facilities.
100kW+
Per rack
Up to 10× the density of conventional air cooling.
50%
Cooling-energy savings
Typical reduction on cooling load post-conversion.
20–50%
Hardware life extension
From eliminating thermal cycling and oxidation.
Our methodology
How we transform a cooling estate.
A four-stage framework that ensures a seamless transition to next-gen cooling — without compromising operational continuity or return on investment.
01
Assessment
Evaluate current infrastructure, workloads, and cooling baselines — identify density ceilings, PUE deltas, and optimization opportunities.
02
Design
Tailored cooling architecture aligned to compute needs, facility constraints, and sustainability targets — from CFD modelling through to fluid selection.
03
Implementation
Executed deployment with minimum operational disruption — hardware installation, fluid management, and full system integration.
04
Optimization
Continuous monitoring and refinement of the cooling system to maximize efficiency, performance, and environmental benefit over time.
Operational & environmental impact
Engineering outcomes, not promises.
Substantial advantages over traditional air cooling — measured in PUE, density, sustainability, and total cost of ownership.
i.
Superior PUE performance
Industry-leading Power Usage Effectiveness ratios as low as 1.05–1.1, compared to 1.4–2.0+ on traditional air-cooled facilities.
ii.
Ultra-high density
Rack densities beyond 100kW — up to 10× conventional air cooling — supporting the most demanding AI/ML and HPC workloads in minimal footprint.
iii.
Lower carbon footprint
Material reduction in both energy consumption and water usage — aligning data center operations with credible ESG and net-zero targets.
iv.
Extended hardware lifespan
Immersion eliminates thermal shock and reduces component degradation, potentially extending hardware life by 20–50%.
v.
Sustained peak performance
Eliminate thermal throttling with consistent cooling across every component — unlocking maximum compute and GPU utilisation under load.
vi.
Acoustic & spatial gain
Removing fans and air-handling equipment dramatically reduces noise — and reclaims floor and ceiling space for compute.
Frequently asked
Common questions.
Immersion cooling submerges hardware directly in a thermally conductive but electrically insulating dielectric fluid. Heat transfers from components into the fluid and is rejected through heat exchangers. This eliminates the inefficiencies of moving large volumes of air, and enables far more effective thermal management — especially for AI, ML, and HPC workloads where rack densities outstrip what air can carry away.
Yes — when properly engineered. The dielectric fluids used are non-conductive and non-corrosive to electronic components. In practice immersion cooling typically extends hardware life by eliminating hotspots and thermal cycling, and by protecting components from oxidation and atmospheric contaminants.
Immersion submerges entire components in dielectric fluid — comprehensive thermal management for densities of 50–150kW per rack. Direct-to-chip uses precision liquid loops and cold plates bonded to processors and GPUs, ideal for targeted cooling of specific high-heat parts in environments above 100kW. Both approaches handle AI/ML, HPC, and crypto workloads that traditional air cannot.
Payback typically falls between 1–3 years, depending on deployment size, energy costs, and density. Returns come from reduced cooling-energy consumption (40–50% savings), increased compute density (up to 10× per square foot), extended hardware life (20–50% longer), and lower maintenance overhead. For large or HPC-intensive sites, ROI can be considerably faster.
In most cases, yes. Our designs are modular and can be implemented incrementally — a phased approach that limits disruption to existing operations. Retrofits typically require addressing floor loading, fluid distribution infrastructure, and heat rejection. We conduct thorough site assessments and develop tailored retrofit strategies that respect each facility's constraints.
Ready to transform
Cool your compute,
shrink your footprint.
Schedule a consultation to discuss how Next-Gen Data Center Cooling can optimize compute performance while reducing energy costs and environmental impact across your estate.
Book a consultation